-
PpLdpe Fiber LateralPFM SKPM MultiferroicMaterials ScanningSpreadingResistanceMicroscopy Polyethylene Multiferroic_materials Adhesive IRDetector IISCBangalore ItoGlass Pattern UTEM Copper KAIST Forevision Chromium 2-vinylpyridine TiO2 lift_mode temp Wildtype Plug PiezoelectricForceMicroscopy TyphimuriumBiofilm ChemicalCompound CP-AFM pinpoint mode MagneticForce CrystalGrowing Indium_tin_oxide Zhi alkanes FailureAnalysis
Report image
If you found this image unacceptable, please let us know. We will review your report and take action if we determine this image is really unacceptable.
Li electroplating (deposition) on Cu foil
Scanning Conditions
- System : NX10 in dry room
- Scan Mode: Contact/EC AFM
- Scan Rate : 0.13 Hz
- Scan Size : 30μm×30μm
- Pixel Size : 256×256
- Cantilever : Multi75-G
- ECr : Cu Foil (Working electrode), Li metal (Reference electrode), Li (Counter electrode), 1M LiTFSI in TEGDME (Electrolyte)
- Open circuit voltage : 3.34 VLi/Li+