Innovation and Efficiency for 3D Metrology
Park Systems이 소개한 획기적인 XE-3DM은 오버행 프로파일, 고해상도 측벽 이미징, 그리고 각도 측정을 위한 전자동 AFM 시스템입니다. 독특한 분리식 XY 및 Z 스캔 시스템과 경사식 Z 스캐너는 정확한 측벽 분석에 있어서 일반적인 팁 방식과 플레어 팁 방식이 가지는 문제점을 극복합니다. Park Systems의 완전 비접촉 모드™을 탑재한 XE-3DM은 고종횡비 팁을 사용하여 소프트 포토레지스트 표면의 비파괴식 측정이 가능합니다.
A fully automated industrial AFM using NX technology
- Clean room compatible and fully automated for measurement and data analysis at the nanoscale level
- NX technology automatically constructs an extremely accurate topographical image and collects essential dimensional data
- The Industry leading,low noise Z-detector works on an independent, closed loop to minimize errors in topography (the “creep effect”)
- True Non-contact™ mode allow for the collection of high resolution and accurate data without tip-sample damage, something that could otherwise cost you valuable time and money
Innovative head design for undercut and overhang structures
- Z-head’s unique sideways orientation allows access to the undercut and overhang structures of photoresist and other industrial material
- Patented decoupled XY and Z scanning systems work together with the tilted Z-scanner, letting users overcome normal challenges in accurate sidewall analysis associated with normal and flare tip methods
- Sidewall trench line profile, roughness, critical angle and critical dimension can all be measured using the NX-3DM
- Z-head tilting mechanism allows access to the sidewalls using an ultra-sharp tip to obtain the same high resolution and definition as is obtained over the rest of the material
A Reliable, Seamless Measurement Tool for 3D materials
- No sample preparation (eg. cutting, mounting or coating) is required to obtain the sidewall roughness or critical dimension measurements in this process
- By utilizing Z-head tilting and True Non-contact™ mode, the NX-3DM allows for both tip-preserving and high resolution collection of sidewall data
×