-
Anneal Dimethicone Corrosion 2-vinylpyridine FM_SKPM Self-assembledMonolayer Holes Ferroelectric NUSNNI Ceramic Piezoelectric BTO Sapphire BFO high_resolution CNT HfO2 NiFe AtomicSteps margarine Ceramics Ferrite ThinFilm Chungnam_National_University AdhesionForce Jason Potential Morphology Terrace LightEmission block_copolymer FastScan IMT_Bucharest Bio Polydimethylsiloxane
Report image
If you found this image unacceptable, please let us know. We will review your report and take action if we determine this image is really unacceptable.
TSV Cu pad oxidation
Scanning Conditions
- System : NX-Wafer
- Scan Mode: Non-contact
- Scan Rate : All 1 Hz
- Scan Size : 40μm×40μm
- Pixel Size : All 512×512
- Cantilever : OMCL-AC160TS (k=26N/m, f=300kHz)