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conductive cooling Device Phase Epoxy STO C60H122 HexagonalBoronNitride Wonseok #Materials Formamidinium_lead_iodide SKKU Etch Stiffness silicon_oxide Al2O3 Workfunction FastScan DomainSwitching LightEmiting Protein AEAPDES MBE EFMAmplitude domain_switching GalliumPhosphide plastic Alloy CP-AFM Tin sulfide H-BN Lateral FrictionalForce Sadowski ScanningIon-ConductanceMicroscopy
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conductive cooling Device Phase Epoxy STO C60H122 HexagonalBoronNitride Wonseok #Materials Formamidinium_lead_iodide SKKU Etch Stiffness silicon_oxide Al2O3 Workfunction FastScan DomainSwitching LightEmiting Protein AEAPDES MBE EFMAmplitude domain_switching GalliumPhosphide plastic Alloy CP-AFM Tin sulfide H-BN Lateral FrictionalForce Sadowski ScanningIon-ConductanceMicroscopy